Analyzation of Heatsink Performance by Least Squares Method and Linear Regression

by Isaiah Wilson

Submitted : Fall 2016

To handle the heating of high execution electronic parts of a motherboards, such as the central processing unit, we have to foresee the temperature profile of the heat sink utilized. This helps to choose the best heat sink for the amount of power a chip may be expected to use. Understanding the temperature profile of a heat sink and a chip makes a difference us to handle its temperature proficiently for variable workloads. This project’s goal is to find a method to estimate the response and efficiency of heat sinks at various usage rates. 

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